FX5U-64MR/ES

฿36,000.00
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FX5U-64MR/ES

MELSEC iQ-F FX5U Series Sequencer CPU

FX5U Series sequencer main body. Available in input/output occupied points of 32/64/96.

MELSEC iQ-F FX5U Series Sequencer CPU Specifications

FX5U-32MR/DS

FX5U-32MR/DS image

FX5U-32MR/DS image

  • CPU performance

The sequence execution engine, which is the heart of the MELSEC iQ-F, is a newly developed execution engine supporting structured programs, execution of multiple programs, ST language, FB, etc.

  • Control scale: up to 512 points

When remote I/Os (CC-Link, AnyWireASLINK or Bitty Series) are used, up to 512 points can be controlled.

  • Simple motion unit can be connected.

By connecting the simple motion unit, SSCNET III/H-compatible positioning becomes possible.
You can create table-method programs combining linear interpolation, 2‑axis arc interpolation and continuous path control to draw smooth paths with ease.

  • Built-in analog input and output (with warning output)

2 channels of analog input and one channel of analog output, both 12‑bit, are built in.
You don’t need a program, so long as parameters are set.
Numerical shift, scaling and warning output are easy to set, using parameters.

  • Built-in Ethernet port

The Ethernet communication port supports communication up to 8 connections on the network, permitting connection with many personal computers and equipment. It also supports remote maintenance and seamless SLMP communication with host equipment, etc.

  • Built-in RS-485 port (with MODBUS function)

The built-in RS-485 communication port enables communication with up to 16 Mitsubishi general-purpose inverters over a distance of up to 50 m. (The inverters can be controlled using 6 applied commands.)
The port also supports the MODBUS function, permitting connection with up to 32 peripherals (including the master) such as sequencers, sensors and temperature control units.

  • Built-in SD card slot

The built-in SD card slot is useful when updating programs or in mass production of equipment.
You will be able to save data logs in an SD card (future function) for use in the analysis of equipment status, production condition, etc.

  • High-speed system bus communication

The MELSEC iQ-F, together with a high-speed CPU, achieves high-speed system bus communication of 1.5k word/ms (approx. 150 times faster than the level achievable with the FX3U), to demonstrate its full capability even when intelligent function units generating a lot of data traffic are used.

  • RUN/STOP/RESET switches

The RUN/STOP switch now has a RESET function.
This increases the debugging efficiency because the system can be restarted without turning off the main power.

  • Security

The MELSEC iQ-F provides security functions (file password, remote password, security key) that are designed to prevent data theft, unauthorized operation, etc., by third parties making illegal access.

  • No battery, maintenance-free

You can save programs without using a battery. Clock data is saved for 10 days using a large-capacity capacitor (the specific period varies depending on the use condition).

  • * You can use an optional battery unit to save (latch) the clock data and device memory in the event of power failure.

FX5U-32MR/DS Performance Specifications

Control Method Stored Program Repeating Operation
Input/Output Control Method Refresh Method
(Direct access input/output is possible by specifying the direct access input/output (DX, DY).)
Programming SpecificationProgramming Language Ladder Diagram (LD), Structured Text (ST), Function Block Diagram / Ladder Language (FBD/LD)
Programming Expansion Function Function Block (FB), Structured Ladder, Label Programming (Local/Global)
Constant Scan 0.2 to 2,000 ms (can be set in 0.1 ms intervals)
Periodic Interrupt 1 to 60,000 ms (can be set in 1 ms intervals)
Timer Performance Specification 100 ms, 10 ms, 1 ms
Program Execution Capacity 32 programs
FB File Capacity 16 files (including up to 15 user files)
Operation SpecificationExecution Type Standby type, initial execution type, scan execution type, periodic execution type, event execution type
Interrupt Type Internal timer interrupt, input interrupt, high-speed comparison & match interrupt, interrupt from unit
Command Processing TimeLD X0 34 ns
MOV D0 D1 34 ns
Memory CapacityProgram Capacity 64k steps
(128 KB, flash memory)
SD Memory Card Memory Card Capacity (SD/SDHC memory card: up to 16 GB)
Device / Label Memory 120 KB
Data Memory / Standard ROM 5 MB
Number Of Writes To Flash Memory (Flash ROM) Maximum 20,000 writes
Maximum File Storage CapacityDevice / Label Memory 1
Data MemoryP: Program File Capacity 32 pieces
FB: FB File Capacity 16
SD Memory Card2 GB 511
Storage capacity in the root folder.
4 GB, 8 GB, 16 GB 65,534
Storage capacity in the root folder.
Clock FunctionDisplayed Information Year, month, day, hour, minutes, seconds, day of the week (Leap years are automatically detected.)
Accuracy Monthly difference ±45 sec / 25°C (TYP)
Number Of Inputs/Outputs(1) Number Of Inputs/Outputs 256 points or less
(2) Number Of Remote I/Os 384 points or less
Total Points Of (1) And (2) 512 points or less
Retention Upon Power Failure (Clock Data)Retention Method Large capacitor
Clock data is retained using the power stored in the large capacitor built in the sequencer. Clock data is not retained correctly if the voltage of the large capacitor drops. In a fully-charged state (power has been supplied to the sequencer for at least 30 minutes), the data can be stored for 10 days using the capacitor (ambient temperature: 25°C). The storage period using the capacitor varies depending on the ambient operating temperature. The higher the ambient operating temperature, the shorter the retention period.
Retention Period 10 days (Ambient temperature: 25°C)
Retention Upon Power Failure (Device)Retention Capacity Upon Power Failure Up to 12k words
All devices in the device (high speed) area can be retained upon power failure. If a battery unit is used, the devices in the device (standard) area can also be retained.
Number Of Devices
Number Of User DevicesInput Relay (X)Octal 1,024 points
The total number of X and Y points assigned to inputs and outputs, is no more than 256.
Output Relay (Y)Octal 1,024 points
The total number of X and Y points assigned to inputs and outputs, is no more than 256.
Internal Relay (M)Decimal 32,768 points (can be changed with a parameter)
The value can be changed with a parameter within the range permitted by the capacity of the built-in CPU memory.
Latch Relay (L)Decimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Link Relay (B)Hexadecimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Annunciator (F)Decimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Link Special Relay (SB)Hexadecimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Step Relay (S)Decimal 4,096 points (fixed)
Timer (Timer (T))Decimal 1,024 points (Can be changed with a parameter)
The value can be changed with a parameter within the range permitted by the capacity of the built-in CPU memory.
Integration Timer (Integration Timer (ST))Decimal 1,024 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Counter (Counter (C))Decimal 1,024 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Counter (Counter (LC))Decimal 1,024 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Data Register (D)Decimal 8,000 points (can be changed with a parameter)
The value can be changed with a parameter within the range permitted by the capacity of the built-in CPU memory.
Link Register (W)Hexadecimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Link Special Register (SW)Hexadecimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Number Of System DevicesSpecial Relay (SM)Decimal 10,000 points (fixed)
Special Register (SD)Decimal 12,000 points (fixed)
Unit Access DeviceIntelligent Function Unit DeviceDecimal 65,536 points (specified by U□¥G□)
Number Of Index RegistersIndex Register (Z)Decimal 24 points
Index registers (Z) and long index registers (LZ) can be set for a total of 24 words or less.
Long Index Register (LZ)Decimal 12 points
Index registers (Z) and long index registers (LZ) can be set for a total of 24 words or less.
Number Of File RegistersFile Register (R)Decimal 32,768 points (can be changed using parameters)
Can be changed using parameters within the CPU built-in memory capacity range.
Number Of NestingsNesting (N)Decimal 15 points (fixed)
Number Of PointersPointer (P)Decimal 4,096 points
Interrupt Pointer (I)Decimal 178 points (fixed)
OtherDecimal Constant (K)Signed 16 bits: -32,768 to +32767
32 bits: -2,147,483,648 to +2,147,483,647
Unsigned 16 bits: 0 to 65,535
32 bits: 0 to 4,294,967,295
Hexadecimal Constant (H) 16 bits: 0 to FFFF
32 bits: 0 to FFFFFFFF
Real Constant (E)Single Precision E-3.40,282,347+38 to E-1.17,549,435-38, 0, E1.17,549,435-38 to E3.40,282,347+38
Character String Shift JIS code, up to 255 single-byte characters (256 characters including NULL)
Power Supply Specification
Rated Voltage 24 V DC
Allowable Voltage Range 16.8 to 28.8 V DC
Rated Frequency -
Allowable Momentary Power Outage Duration Operation will continue following a momentary power outage of 5 ms or less.
Power Supply Fuse 250 V 3.15 A Time Lag Fuse
Inrush Current Max. 50 A for 0.5 ms or less / 24 V DC
Power Consumption 30 W
The value assumes a configuration based on the maximum allowable connections, consuming all 24‑V DC power. (Input circuit current is included.)
24‑V DC Power Capacity 480 mA (360 mA)
* Built-in 24‑V DC power supply. Consumptions by the connected I/O units, etc., reduce the usable current.
The value in ( ) indicates the power supply capacity when the power-supply voltage is 26.8 to 19.2 V DC.
Built-In 5‑V DC Power Supply Capacity 900 mA (775 mA)
* Capacity of power supply to I/O units, intelligent function units, expansion adapters and expansion boards.
The value in ( ) indicates the power supply capacity when the power-supply voltage is 26.8 to 19.2 V DC.
For details, refer to the MELSEC iQ-F FX5U User’s Manual (Hardware).
Input Specification
Number Of Input Points 16 points
Input Connection Format Screw Type Terminal Block (M3 Screw)
Input Format Sink/Source
Input Signal Voltage 24 V DC +20%, -15%
Input Signal CurrentX000 To X017 5.3 mA / 24 V DC
X020 or Later -
Input ImpedanceX000 to X017 4.3 kΩ
X020 or Later -
Input ON Sensing CurrentX000 to X017 3.5 mA or more
X020 or Later -
Input OFF Sensing Current 1.5 mA or less
Input Response FrequencyX000 To X005 200 kHz
Set as follows if inputs X000 to X007 (X000 to X005 for FX5U-32M□) are used to import pulses of response frequencies between 50 kHz and 200 kHz.
● Set the wiring length to 5 m or less.
● Use a shielded twisted paired cable for the connection cable. Ground the shield of the shielded wire on one side (CPU unit side).
● Connect a bleeder resistor of 1.5 kΩ (1 W or more) to the input terminal, and set the load current of the open-collector transistor output on the connected equipment side to 20 mA or more including the input current of the main body.
The above restrictions may vary depending on the specifications of the connected equipment (encoder, etc.). Adjust the cable length and load according to the connected equipment.
X006 To X017 10 kHz
Input Response Time (H/W Filter Delay)X000 to X005 ON: 2.5 μs or less
OFF: 2.5 μs or less
X006 to X017 ON: 30 μs or less
OFF: 50 μs or less
Input Response Time (Digital Filter Setting Value) None, 10 μs, 50 μs, 0.1 ms, 0.2 ms, 0.4 ms, 0.6 ms, 1 ms, 5 ms, 10 ms (default), 20 ms, 70 ms
If the use environment is subject to a lot of noise, set a digital filter.
Input Signal Format Non-voltage Contact Input
Sink: NPN Open Collector Transistor
Source: PNP Open Collector Transistor
Input Circuit Insulation Photocoupler Insulation
Input Operation Indicator The LED is lit when the input is ON.
Output Specification
Number Of Outputs 16 points
Output Connection Format Screw Type Terminal Block (M3 Screw)
Output Type Relay Output
External Power Supply 30 V DC or less
240 V AC or less (250 V AC or less if not compliant with the CE, UL or cUL standard)
Maximum Load 2 A/point
See below for the total load current per common.
Common for 4 output points: 8 A or less
Common for 8 output points: 8 A or less
Minimum Load 5 V DC for 2 mA (reference value)
Leakage Current When Open -
Response TimeOFF → ON Approx. 10 ms
ON → OFF Approx. 10 ms
Output Circuit Insulation Mechanical Insulation
Output Operation Indicator The LED is lit when the output is ON.

FX5U-32MR/DS Function Specifications

Scan Monitor Function (Watchdog Timer Setting) The scan time is monitored to detect CPU unit hardware and program errors.
Clock Function This function is used for time management relating to date-stamping of error history and other system functions.
Runtime WriteRuntime Circuit Block Change Portions edited on the ladder editing screen of the engineering tool are written to the CPU unit for each circuit. Edited items that apply to multiple locations can be written to the CPU unit all at once.
Interrupt FunctionMultiple Interrupt Function Assume that, when an interrupt program is running, an interrupt due to a different reason occurs. In this case, the program of the lower priority is interrupted, and the program of the higher priority, whose running conditions are satisfied, is run.
PID Control Function PID control is performed using PID control commands.
Constant Scan A program is run repeatedly while maintaining a constant scan time.
Remote OperationRemote RUN/STOP While keeping the RUN/STOP/RESET switch on the CPU unit at the RUN position, the CPU unit is changed to the RUN/STOP/PAUSE state externally.
Remote PAUSE While keeping the RUN/STOP/RESET switch on the CPU unit at the RUN position, the CPU unit is changed to the RUN/STOP/PAUSE state externally.
Remote RESET When the CPU unit is in the STOP state, an external operation is performed to reset the CPU unit.
Device / Label Memory Area Setting The capacity of each device / label memory area is set.
Default Device Settings The devices used by a program is set without using program.
Latch Function The CPU unit settings for devices/labels are retained after a power outage, or even when the power is turned off and then turned back on.
Memory Card FunctionSD Memory Card Abort Even when a function that uses an SD memory card is running, use of the SD memory card can be stopped without turning off the power.
Boot Operation The files stored in the SD memory card are transferred to the transfer destination memory automatically determined by the CPU unit, when the CPU unit power is turned off and then turned back on or the CPU unit is reset.
Device / Label Access Service Processing Setting The number of times the device / label access service processing is implemented as part of the end processing, is set by a parameter.
RAS FunctionSelf-Diagnostic Function The CPU unit diagnoses itself for error.
Error Reset All present errors are reset at once.
Security Function The customer’s assets saved to the personal computer or FX5 system unit is protected against theft, falsification, mis-operation, unauthorized execution, etc., by third parties making illegal access.
High-Speed Input/Output FunctionHigh-Speed Counter Function Inputs to the CPU unit and high-speed pulse I/O unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, etc.
Pulse Width Measurement Function Inputs to the CPU unit and high-speed pulse I/O unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, etc.
Input Interrupt Function Inputs to the CPU unit and high-speed pulse I/O unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, etc.
Positioning Function Transistor outputs from the CPU unit, and the high-speed pulse I/O unit, can be used to perform positioning operation.
PWM Output Function Transistor outputs from the CPU unit, and the high-speed pulse I/O units, can be performed to generate PWM outputs.
Built-In Analog FunctionAnalog Input Function The FX5U CPU unit has 2 points of built-in analog input to allow voltage input.
Analog Output Function The FX5U CPU unit has one point of built-in analog output to allow voltage output.
Built-In Ethernet Function Ethernet-related functions such as connecting the MELSOFT product and GOT, and socket communication.
Serial Communication Function Serial communication-related functions such as simple links between personal computers, MC protocol, inverter communication function and non-procedural communication.
MODBUS RTU Communication Function MODBUS RTU-compatible products can be connected. Master/slave function can be used.

FX5UC-32MR/DS General Specifications

Ambient Operating Temperature -20 to 55°C, assuming no icing
Subject to input/output derating. For details, refer to the MELSEC iQ-F FX5U User’s Manual (Hardware).
0 to 55°C for products manufactured before June 2016. For an intelligent function unit, refer to the manual for each product.
The following equipment cannot be used at an ambient temperature below 0°C:
FX5-40SSC-S, FX5-CNV-BUS, FX5-CNV-BUSC, battery (FX3U-32BL), SD memory card (NZ1MEM-2GBSD, NZ1MEM-4GBSD, NZ1MEM-8GBSD, NZ1MEM-16GBSD, L1MEM-2GBSD, L1MEM-4GBSD), FX3 expansion unit, terminal unit, I/O cable (FX-16E-500CAB-S, FX-16E-□CAB, FX-16E-□CAB-R)
The specifications vary if used in an environment below 0°C. For details, refer to the MELSEC iQ-F FX5U User’s Manual (Hardware).
Ambient Storage Temperature -25 to 75°C, assuming no icing
Ambient Operating Humidity 5 to 95% RH, assuming no condensation
If the product is used in a low-temperature environment, make sure sudden temperature shift does not occur. If sudden temperature shift occurs due to opening/closing of the control panel, etc., condensation may occur and cause fire, failure or malfunction. Also, provide air-conditioning to dehumidify the air to prevent condensation.
Ambient Storage Humidity 5 to 95% RH, assuming no condensation
Vibration ResistanceWhen Mounting To DIN RailFrequency: 5 to 8.4 Hz Single amplitude: 1.75 mm, 10 times in each direction of X, Y and Z (total 80 minutes each)
The judgment criteria shall conform to IEC61131-2.
If any equipment whose vibration specification is lower than the above is incorporated into the system, the vibration resistance specification of the entire system is reduced to the specification of that equipment.
Frequency: 8.4 to 150 Hz Acceleration: 4.9 m/s210 times in each direction of X, Y and Z (total 80 minutes each)
The judgment criteria shall conform to IEC61131-2.
If any equipment whose vibration specification is lower than the above is incorporated into the system, the vibration resistance specification of the entire system is reduced to the specification of that equipment.
When Mounting DirectlyFrequency: 5 To 8.4 Hz Single amplitude: 3.5 mm, 10 times in each direction of X, Y and Z (total 80 minutes each)
The judgment criteria shall conform to IEC61131-2.
If any equipment whose vibration specification is lower than the above is incorporated into the system, the vibration resistance specification of the entire system is reduced to the specification of that equipment.
Frequency: 8.4 To 150 Hz Acceleration: 9.8 m/s2 10 times in each direction of X, Y and Z (total 80 minutes each)
The judgment criteria shall conform to IEC61131-2.
If any equipment whose vibration specification is lower than the above is incorporated into the system, the vibration resistance specification of the entire system is reduced to the specification of that equipment.
Impact Resistance 147 m/s2, for a duration of 11 ms, three times in each two-way direction of X, Y and Z with a half-sine pulse
The judgment criteria shall conform to IEC61131-2.
Noise Resistance Achieved through a noise simulator with a noise voltage of 1,000 Vp-p, noise width of 1 μs and frequency of 30 to 100 Hz
Withstand VoltageBetween Power Supply Terminal (DC Power Supply) And Earth Terminal 500 V AC for 1 min
Between 24‑V DC Service Power Supply / Input Terminal (24 V DC) And Earth Terminal 500 V AC for 1 min
Between Output Terminal (Relay) And Earth Terminal 1.5k V AC for 1 min
Insulation ResistanceBetween Power Supply Terminal (DC Power Supply) And Earth Terminal 10 MΩ or more at 500 V DC on an insulation resistance meter
Between 24‑V DC Service Power Supply / Input Terminal (24 V DC) And Earth Terminal 10 MΩ or more at 500 V DC on an insulation resistance meter
Between Output Terminal (Relay) And Earth Terminal 10 MΩ or more at 500 V DC on an insulation resistance meter
Earthing Class D earthing (earthing resistance: 100 Ω or less) <No common earthing with a strong magnetic system>
<Precaution>
· Provide dedicated earthing whenever possible.
· If dedicated earthing cannot be provided, use common earthing. (Refer to the manual for details.)
· Use an earthing wire of AWG14 (2 mm2) or larger in size.
· Bring the earthing point as close as possible to the sequencer to shorten the earthing wire.
Operating Atmosphere There shall be no corrosion gas or flammable gas and not much conductive dust.
Operating Altitude 0 to 2,000 m
Cannot be used in a pressurized environment of atmospheric pressure or higher.
Failures may occur.
Installation Location Inside the control panel
Overvoltage Category II or lower
Indicates the assumed power distribution point to which the applicable equipment is connected between the public power distribution network and the mechanical system in plant. Category II applies to the equipment to which power is supplied from a fixed facility. The surge resistance voltage of equipment of up to 300 V in rating is 2,500 V.
Pollution Degree 2 or lower
Index to indicate the degree of conductive material generation in the environment in which the applicable equipment is used. Pollution degree 2 indicates that only non-conductive contaminants will generate. In this environment, however, temporary conduction may occur due to accidental condensation.
Equipment Class Class 2
  • * See the catalog for model numbers other than those detailed above.

Basic Information

UL UL, CUL Standards KC Standard
More Information
Power supply VAC 100–240
Part Number FX5U-64MR/ES
Number of Inputs/Outputs(Point) 64
Number Of Inputs(Point) 32
Number of Outputs(Point) 32
Input specifications 24 VDC Sink/Source
Output Specification Relay
Program size(k step) 64
RS232 yes
USB yes
Ethernet yes
Computer Link yes
CC-Link yes
Data Note AC power supply DC input, screw-type terminal block type, built-in analog input: 2 ch, built-in analog output: 1 ch, built-in high speed counter: maximum 6 ch 200 kHz+2ch 10 kHz, built-in ethernet port: 1 ch, built-in RS-485 port: 1 ch
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